【国外标准】 Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits

4.1 This practice is useful as one method of controlling some electroplating solutions. It serves to indicate the presence of contamination or some other adverse condition.4.2 Ductility measurements are of particular value when electroplated parts are to be subjected to moderate stress such as that involved in bolting an electroplated bumper to an automobile or when exposed to a wide range of fluctuating temperatures (thermal shock).1.1 This practice describes a procedure for measuring the ductility of electrodeposited foils.21.2 This practice is suitable only for the evaluation of electrodeposits having low ductility.1.3 The obtained ductility values must only be considered semi-quantitative because this test has a significant operator dependence.1.4 This practice is best used for in-house process control where measurements are always made by the same operator. A change in ductility value can be used as an indication of possible changes in the electroplating solution.1.5 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.1.6 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.1.7 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.