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【国际标准】 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
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2025-01-04
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标准简介适用范围：
暂无
标准号：
IEC 60068-2-69:2017 EN-FR
标准名称：
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
英文名称：
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method标准状态：
现行-
发布日期：
2017-03-07 -
实施日期：
出版语种：
EN-FR
- 其它标准
- 上一篇： IEC 60068-2-69:2007 EN_D 6449313e Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
- 下一篇： IEC 60068-2-69:2017+AMD1:2019 CSV EN-FR fb31dcb9 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
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- IEC 60068-2-58:2015+AMD1:2017 CSV EN 0a662ce2 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
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- IEC 60068-2-69:2007 EN-FR 922ec2ab Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
- IEC 60068-2-69:2007 EN_D 6449313e Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
- IEC 60068-2-69:2017 EN-FR a9265d4a Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
