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【国际标准】 Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application
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2024-05-13
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标准简介适用范围：
暂无
标准号：
IEC 62047-37:2020 EN-FR
标准名称：
Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application
英文名称：
Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application标准状态：
现行-
发布日期：
2020-04-28 -
实施日期：
出版语种：
EN-FR
- 其它标准
- 上一篇： IEC 62047-36:2019 EN 294c9b3d Semiconductor devices – Micro-electromechanical devices – Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
- 下一篇： IEC 62047-38:2021 EN 0adeaed8 Semiconductor devices - Micro-electromechanical devices - Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection
- 推荐标准
- IEC 62047-30:2017 EN 82a50db2 Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
- IEC 62047-33:2019 EN ea621cee Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device
- IEC 62047-34:2019 EN c830a7c5 Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for MEMS piezoresistive pressure-sensitive device on wafer
- IEC 62047-36:2019 EN 294c9b3d Semiconductor devices – Micro-electromechanical devices – Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
- IEC 62047-37:2020 EN-FR 7a78894f Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application
