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【国外标准】 Standard Test Method for Analysis of Tin-Based Solder Alloys for Minor and Trace Elements Using Inductively Coupled Plasma Atomic Emission Spectrometry

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适用范围:

4.1 Tin-based solder alloys are commonly used to manufacture electrical and electronic goods. The elements lead, cadmium, mercury, antimony and bismuth are often declarable substances in solder materials. This test method provides a means of determining the listed declarable substances, as well as other minor and trace constituents, in tin-based solder alloys.4.2 Two methods of dissolving tin-based solder alloys are given in this standard. The first method uses open-vessel hydrofluoric and nitric acid room temperature digestions; the second method employs closed-vessel nitric and hydrofluoric acid microwave digestions, both for use only with ICP-AES instruments equipped with a hydrofluoric acid resistant sample introduction system.4.3 The method of preparing calibration solutions uses 1000 mg/kg single element reference material solutions, and uses matching concentrated acids for both the calibration solutions and the sample solutions.4.4 This test method is intended for use by laboratories experienced with the set-up, calibration and analysis of samples using ICP-AES.1.1 This test method covers procedures for the analysis of tin-based solder alloys for minor and trace elements using inductively-coupled plasma atomic emission spectrometry (ICP-AES) instrumentation.1.2 These test procedures were validated for the analytes and mass fractions listed below.Element Validated Mass FractionRange, mg/kg   Lead 115 to 965Cadmium 25 to 60Mercury 5 to 530Antimony 85 to 1330Bismuth 80 to 210Arsenic 95 to 360Silver 4000 to 42100Cobalt 0.5 to 60Iron 15 to 115Chromium 0.5 to 1.5Copper 3000 to 30600Indium 25 to 115Nickel 5 to 150Phosphorus 10 to 110Selenium 1 to 30Zinc 2 to 160Aluminum 1 to 31.3 The procedures appear in the following order:Procedure SectionInternal Standardization 8Calibration Solution Preparations 9Preparation of Sample and Validation Solutions 10Calibration 11Analysis Procedure 121.4 The values stated in SI units are to be regarded as the standard. Any other values are for information only.1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.1.6 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

基本信息

  • 标准号:

    ASTM F3139-15(2023)

  • 标准名称:

    Standard Test Method for Analysis of Tin-Based Solder Alloys for Minor and Trace Elements Using Inductively Coupled Plasma Atomic Emission Spectrometry

  • 英文名称:

    Standard Test Method for Analysis of Tin-Based Solder Alloys for Minor and Trace Elements Using Inductively Coupled Plasma Atomic Emission Spectrometry
  • 标准状态:

    Active
  • 发布日期:

  • 实施日期:

  • 出版语种:

标准分类号

  • 标准ICS号:

    25.220.40
  • 中标分类号:

关联标准

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出版信息

  • 页数:

    8 页
  • 字数:

  • 开本:

其他信息

  • 起草人:

  • 起草单位:

  • 归口单位:

    F40.01
  • 提出部门:

  • 发布部门:

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