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【国际标准】 Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
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2024-05-13
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标准简介适用范围：
暂无
标准号：
IEC 61189-1:1997/AMD1:2001 EN-FR
标准名称：
Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
英文名称：
Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology标准状态：
现行-
发布日期：
2001-08-09 -
实施日期：
出版语种：
EN-FR
- 其它标准
- 上一篇： IEC 61189-1:1997+AMD1:2001 CSV EN-FR d163bf94 Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
- 下一篇： IEC 61189-2-501:2022 EN-FR 0473a9a4 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
- 推荐标准
- IEC PAS 61249-8-1:2014 EN f36f12bd Qualification and performance of electrical insulating compound for printed wiring assemblies
- IEC TR 61189-5-506:2019 EN 3059c021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
- IEC TR 63017:2015 EN 9c04821c Flexible printed circuit boards (FPCBs) - Method of compensation of impedance variations
- IEC 60947-4-3:2014 EN-FR 586da29a Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - AC semiconductor controllers and contactors for non-motor loads
- IEC 61188-5-3:2007 EN-FR 164db7fe Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
- IEC 61188-5-4:2007 EN_D b65fb522 Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
- IEC 61188-5-8:2007 EN-FR 8c4a78c6 Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
- IEC 61188-5-8:2007 EN_D 25d727c6 Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
- IEC 61188-6-4:2019 EN-FR 1bdbd71d Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
- IEC 61188-7:2009 EN_D 4950c8a6 Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
- IEC 61188-7:2017 EN 51b792b7 Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
- IEC 61189-11:2013 EN-FR f0c0fb3f Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
- IEC 61189-1:1997+AMD1:2001 CSV EN-FR d163bf94 Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
- IEC 61189-1:1997/AMD1:2001 EN-FR 1b911feb Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
- IEC 61189-2-630:2018 EN-FR 964e058d Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures – Moisture absorption after pressure vessel conditioning
