
【国际标准】 Semiconductor devices – Micro-electromechanical devices - Part 35: Test method of electrical characteristics under bending deformation for flexible electro-mechanical devices
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适用范围:
暂无
标准号:
IEC 62047-35:2019 EN-FR
标准名称:
Semiconductor devices – Micro-electromechanical devices - Part 35: Test method of electrical characteristics under bending deformation for flexible electro-mechanical devices
英文名称:
Semiconductor devices – Micro-electromechanical devices - Part 35: Test method of electrical characteristics under bending deformation for flexible electro-mechanical devices标准状态:
现行-
发布日期:
2019-11-22 -
实施日期:
出版语种:
EN-FR
- 其它标准
- 上一篇: IEC 62047-34:2019 EN c830a7c5 Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for MEMS piezoresistive pressure-sensitive device on wafer
- 下一篇: IEC 62047-36:2019 EN 294c9b3d Semiconductor devices – Micro-electromechanical devices – Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
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