【国际标准】 Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

本网站发布时间： 2024-05-13

开通会员免费在线看70000余条国内标准，赠送文本下载次数，单本最低仅合13.3元！还可享标准出版进度查询、定制跟踪推送、标准查新等超多特权！查看详情>>

标准简介

暂无

标准号：
IEC 60191-6-21:2010 EN-FR
标准名称：
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
英文名称：
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
标准状态：
现行
发布日期：
2010-08-30
实施日期：
出版语种：
EN-FR

IEC 60191-6-21:2010 EN-FR