
【国际标准】 Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
本网站 发布时间:
2024-05-13
开通会员免费在线看70000余条国内标准,赠送文本下载次数,单本最低仅合13.3元!还可享标准出版进度查询、定制跟踪推送、标准查新等超多特权!  
查看详情>>

适用范围:
暂无
标准号:
IEC 62047-15:2015 EN-FR
标准名称:
Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
英文名称:
Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass标准状态:
废止-
发布日期:
2015-03-05 -
实施日期:
出版语种:
EN-FR
- 其它标准
- 上一篇: IEC 62047-14:2012 EN-FR f11d6f75 Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
- 下一篇: IEC 62047-16:2015 EN-FR d9fb3d9d Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
- 推荐标准
- IEC TR 62258-4:2012 EN-FR 06f2bbf0 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
- IEC TR 62258-8:2008 EN 3c50887d Semiconductor die products - Part 8: EXPRESS model schema for data exchange
- IEC TR 63357:2022 EN 5464e586 Semiconductor devices - Standardization roadmap of fault test method for automotive vehicles
- IEC 60050-523:2018 EN-FR 8aff8600 International Electrotechnical Vocabulary (IEV) - Part 523: Micro-electromechanical devices
- IEC 60747-14-2:2000 EN d723dc8f Semiconductor devices - Part 14-2: Semiconductor sensors - Hall elements
- IEC 60747-15:2010 EN-FR b5432232 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
- IEC 60747-15:2024 EN-FR 1676ffd5 Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices
- IEC 60747-15:2024 RLV EN 5b4b7d20 Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices
- IEC 60747-16-1:2001 EN-FR 4379d2b9 Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
- IEC 60747-16-1:2001+AMD1:2007+AMD2:2017 CSV EN-FR 13584447 Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
- IEC 60747-16-3:2002 EN-FR 8dc67fbb Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
- IEC 60747-16-3:2002 EN_D a816f8df Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
- IEC 60747-16-3:2002+AMD1:2009+AMD2:2017 CSV EN-FR 21efddcc Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
- IEC 60747-16-3:2002/AMD1:2009 EN-FR 84d8412e Amendment 1 - Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
- IEC 60747-16-4:2004 EN-FR f6f892dd Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches