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【国际标准】 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles
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2025-01-04
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标准简介适用范围：
暂无
标准号：
IEC 61189-5-301:2021 EN-FR
标准名称：
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles
英文名称：
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles标准状态：
现行-
发布日期：
2021-03-17 -
实施日期：
出版语种：
EN-FR
- 其它标准
- 上一篇： IEC 61189-5-2:2015 EN-FR c778f705 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
- 下一篇： IEC 61189-5-3:2015 EN-FR eb3172fe Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
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