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【国际标准】 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
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2025-01-04
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标准简介适用范围：
暂无
标准号：
IEC 61189-5:2006 EN-FR
标准名称：
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
英文名称：
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies标准状态：
废止-
发布日期：
2006-08-29 -
实施日期：
出版语种：
EN-FR
- 其它标准
- 上一篇： IEC 61189-5-601:2021 EN-FR 0564fa4c Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
- 下一篇： IEC 61189-5:2006 EN_D 17a36431 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
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