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【国际标准】 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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2025-01-04
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标准简介适用范围：
暂无
标准号：
IEC 61190-1-3:2007+AMD1:2010 CSV EN-FR
标准名称：
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
英文名称：
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications标准状态：
REVISED-
发布日期：
2010-11-10 -
实施日期：
出版语种：
EN-FR
- 其它标准
- 上一篇： IEC 61190-1-3:2007 EN_D 19ba23fb Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
- 下一篇： IEC 61190-1-3:2007/AMD1:2010 EN-FR 78299342 Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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