
【国外标准】 Standard Guide for Ultrasonic C-Scan Bond Evaluation of Brazed or Welded Electrical Contact Assemblies (Withdrawn 2013)
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2024-02-28
- ASTM B773-96(2008)
- Withdrawn, No replacement
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适用范围:
This guide is recommended to be used in preparing specifications for the non-destructive evaluation of brazed or welded electrical contact bonded area.6 The recommended procedures are meant to improve the reproducibility of test data among various laboratories. Specific differences among equipment models and technician skills do exist which will limit absolute correlation. This guide provides an indication of the degree of variability which has been observed as realistic among industry participants. Ultrasonic testing alone does not insure an understanding of bonded integrity. Other attributes (that is, strength) may require correlation with destructive test methods.1.1 This guide describes ultrasonic testing procedures that can be used for evaluating the bond quality of electrical contact assemblies manufactured by brazing or welding. 1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only. 1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to become familiar with all hazards including those identified in the appropriate Material Safety Data Sheet (MSDS) for this product/material as provided by the manufacturer, to establish appropriate safety and health practices, and determine the applicability of regulatory limitations prior to use.
标准号:
ASTM B773-96(2008)
标准名称:
Standard Guide for Ultrasonic C-Scan Bond Evaluation of Brazed or Welded Electrical Contact Assemblies (Withdrawn 2013)
英文名称:
Standard Guide for Ultrasonic C-Scan Bond Evaluation of Brazed or Welded Electrical Contact Assemblies (Withdrawn 2013)标准状态:
Withdrawn, No replacement-
发布日期:
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实施日期:
出版语种:
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