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【国际标准】 Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating
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2025-01-04
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标准简介适用范围：
暂无
标准号：
IEC TR 62240-1:2018 RLV EN
标准名称：
Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating
英文名称：
Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating标准状态：
现行-
发布日期：
2018-03-13 -
实施日期：
出版语种：
EN
- 其它标准
- 上一篇： IEC TR 62240-1:2018 EN 679550b5 Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating
- 下一篇： IEC TR 62240-2:2018 EN 941f148f Process management for avionics – Electronic components capability in operation – Part 2: Semiconductor microcircuit lifetime
- 推荐标准
- IEC TR 62240-1:2013 EN e969b5d2 Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating
- IEC TR 62240-1:2018 EN 679550b5 Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating
- IEC TR 62240-1:2018 RLV EN 52df2b86 Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating
- IEC TR 62240-2:2018 EN 941f148f Process management for avionics – Electronic components capability in operation – Part 2: Semiconductor microcircuit lifetime
- IEC TR 62396-6:2017 EN 153dfc1c Process management for avionics - Atmospheric radiation effects - Part 6: Extreme space weather - Potential impact on the avionics environment and electronics
- IEC TR 62500:2024 EN 52d44ea5 Process management for avionics - Highly severe stress tests for operating margins identification and robustness improvement of avionics equipment - Application guidelines
- IEC TS 62239-2:2017 EN db6f26dd Process management for avionics - Management plan - Part 2: Preparation and maintenance of an electronic COTS assembly management plan
- IEC TS 62239:2003 EN f33fb547 Process management for avionics - Preparation of an electronic components management plan
- IEC TS 62647-1:2012 EN 12010759 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
- IEC TS 62647-23:2013 EN e995a36e Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
- IEC TS 62647-2:2012 EN 47581161 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin
- IEC TS 62647-3:2014 EN 402f625c Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
- IEC TS 62647-4:2018 EN cb3d42c8 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling
- IEC TS 62668-1:2012 EN 14e6224d Process management for avionics - Counterfeit prevention - Part 1: Avoiding the use of counterfeit, fraudulent and recycled electronic components
- IEC TS 62686-1:2020 EN a5af0581 Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
