IEC 61189-3-719:2016 EN-FR c98081d0
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
现行
发布日期 :
2016-01-05
实施日期 :
IEC 61189-5-4:2015 EN-FR a64b8d2d
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
现行
发布日期 :
2015-01-08
实施日期 :
IEC 61189-5-601:2021 EN-FR 0564fa4c
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
现行
发布日期 :
2021-02-03
实施日期 :